Esticast 3D Camera Market Review

Esticast: The global 3D Camera market was valued at 1.31b in 2017, and is projected to reach $12b by 2025, growing at a CAGR of 35.5% from 2017 to 2025. In 2017, stereo vision 3D camera segment held a considerably large share of the overall market:

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LED Flicker Tutorial Paper

IE 2008 publishes a paper " LED flicker: Root cause, impact and measurement for automotive imaging applications " by Brian Deegan, Valeo Vision Systems. " In recent years, the use of LED lighting has become widespread in the automotive environment, largely because of their high energy efficiency, reliability, and low maintenance costs. There has also been a concurrent increase in the use and complexity of automotive camera systems. To a large extent, LED lighting and automotive camera technology evolved separately and independently. As the use of both technologies has increased, it has become clear that LED lighting poses significant challenges for automotive imaging i.e. so-called "LED flicker". LED flicker is an artifact observed in digital imaging where an imaged light source appears to flicker, even though the light source appears constant to a human observer. This paper defines the root cause and manifestations of LED flicker. It defines the use cases wher...

Film-Based Light Sensing Review

University of Toronto repo publishes a Nature paper from January 2017 "Solution-processed semiconductors for next-generation photodetectors" by F. Pelayo García de Arquer, Ardalan Armin, Paul Meredith, and Edward H. Sargent. " Efficient light detection is central to modern science and technology. Current photodetectors mainly use photodiodes based on crystalline inorganic elemental semiconductors, such as silicon, or compounds such as III–V semiconductors. Photodetectors made of solution-processed semiconductors — which include organic materials, metal-halide perovskites and quantum dots — have recently emerged as candidates for next-generation light sensing. They combine ease of processing, tailorable optoelectronic properties, facile integration with complementary metal–oxide–semiconductors, compatibility with flexible substrates and good performance. Here, we review the recent advances and the open challenges in the field of solution-processed photodetectors, examin...

Synaptics Under-Display Fingerprint Scanner Reverse Engineering

SystemPlus Consulting publishes a reverse engineering report of Synaptics’ under-display fingerprint scanner found inside the VIVO X21 UD Smartphone: " This scanner uses optical fingerprint technology that allows integration under the display. With a stainless steel support and two flexible printed circuit layers, the Synaptics fingerprint sensor’s dimensions are 6.46 mm x 9.09 mm, with an application specific integrated circuit (ASIC) driver in the flex module. This image sensor is also assembled with a glass substrate where filters are deposited. The sensor has a resolution of 30,625 pixels, with a pixel density of 777ppi. The module’s light source is providing by the OLED display glasses. The fingerprint module uses a collimator layer corresponding to the layers directly deposited on the die sensor and composed of organic, metallic and silicon layers. This only allows light rays reflected at normal incidence to the collimator filter layer to pass through and reach the optical ...

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