Skip to main content

SmartSens GS BSI Sensor

ECN publishes an interview with Leo Bai, CM of Artificial Intelligent BU at SmartSens "How Is Image Sensing Technology Moving Forward?". Few quotes:

"With rapid development of AI and MV technology, there will be a growing number of new applications that need CIS to get direct data for processing and analyzing. This will present much broader market opportunities for image sensors than ever before.

In order to meet the market needs, SmartSens has developed cost-effective, high-performance global shutter CIS for emerging AI and MV applications, i.e. the world's first BSI-based global shutter CMOS image sensor family (SmartGS). Because of its excellent signal-to-noise ratio, high sensitivity, and dynamics, the SmartGS image sensors are widely used in FA, code reader, intelligent sensing, and other fields.

SC031GS is the world’s first commercial-grade 300,000-pixel global shutter CMOS image sensor based on BSI pixel technology. BSI technology makes SC031GS more sensitive. Derived from high-end industrial CIS, SmartGS design technology guarantees low system noise, high-shutter efficiency, single-frame HDR, among other features. Because of these high performances, SC031GS is becoming popular in intelligent sensing (drone, robotics) and IoT industries. Designed for intelligent applications like face to vSLAM, optical flow, 2D-decoder, and gesture recognition, SC031GS’s design is fully considered about system solution. So, SC031GS is better suited for intelligent applications than other competitors.
"

Comments

Popular posts from this blog

Film-Based Light Sensing Review

University of Toronto repo publishes a Nature paper from January 2017 "Solution-processed semiconductors for next-generation photodetectors" by F. Pelayo GarcĂ­a de Arquer, Ardalan Armin, Paul Meredith, and Edward H. Sargent. " Efficient light detection is central to modern science and technology. Current photodetectors mainly use photodiodes based on crystalline inorganic elemental semiconductors, such as silicon, or compounds such as III–V semiconductors. Photodetectors made of solution-processed semiconductors — which include organic materials, metal-halide perovskites and quantum dots — have recently emerged as candidates for next-generation light sensing. They combine ease of processing, tailorable optoelectronic properties, facile integration with complementary metal–oxide–semiconductors, compatibility with flexible substrates and good performance. Here, we review the recent advances and the open challenges in the field of solution-processed photodetectors, examin...

Microsoft Proposes Government Regulation of Facial Recognition Use

Microsoft President Brad Smith writes in the company blog : " Advanced technology no longer stands apart from society; it is becoming deeply infused in our personal and professional lives. This means the potential uses of facial recognition are myriad. Some emerging uses are both positive and potentially even profound. But other potential applications are more sobering. Imagine a government tracking everywhere you walked over the past month without your permission or knowledge. Imagine a database of everyone who attended a political rally that constitutes the very essence of free speech. Imagine the stores of a shopping mall using facial recognition to share information with each other about each shelf that you browse and product you buy, without asking you first. Perhaps as much as any advance, facial recognition raises a critical question: what role do we want this type of technology to play in everyday society? This in fact is what we believe is needed today – a government init...

Synaptics Under-Display Fingerprint Scanner Reverse Engineering

SystemPlus Consulting publishes a reverse engineering report of Synaptics’ under-display fingerprint scanner found inside the VIVO X21 UD Smartphone: " This scanner uses optical fingerprint technology that allows integration under the display. With a stainless steel support and two flexible printed circuit layers, the Synaptics fingerprint sensor’s dimensions are 6.46 mm x 9.09 mm, with an application specific integrated circuit (ASIC) driver in the flex module. This image sensor is also assembled with a glass substrate where filters are deposited. The sensor has a resolution of 30,625 pixels, with a pixel density of 777ppi. The module’s light source is providing by the OLED display glasses. The fingerprint module uses a collimator layer corresponding to the layers directly deposited on the die sensor and composed of organic, metallic and silicon layers. This only allows light rays reflected at normal incidence to the collimator filter layer to pass through and reach the optical ...