King Klon

Omnivision patent application US20180249105 " Image Sensor with Two-Dimensional Split Dual Photodiode Pairs " by Gang Chen, Qin Wang, Duli Mao, and Lindsay Grant proposes cross-type PDAF pixels that are also used for a regular image sensing:

IHS Markit estimates Apple iPhone Xs Max camera components cost at $51.10 out of the total BOM of $390:

Sony officially unveils IMX250MZR / MYR polarization sensitive image sensors. The IMX250MZR monochromatic version is available now, while color IMX250MYR is expected to be available in December 2018. The 5.07MP sensors use 3.45µm global shutter pixel with four-directional polarizer formed on the photodiode: " With conventional types of polarization sensors, the polarizer is attached on top of the on-chip lens layer (Fig.2), however with Sony Semiconductor Solutions’ polarization sensor the polarizer is formed on chip under the on-chip lens layer (Fig.3). A shorter distance between the polarizer and the photodiode improves the extinction ratio and the incident angle dependence. Since the polarizer is formed during the semiconductor process, form and formulation of polarizer, uniformity, mass productivity and durability are excellent compared to conventional polarization sensors. Furthermore, Sony Semiconductor Solutions’ Polarization sensor is covered with an anti-reflection layer...

Apple keeps filing continuation applications for its stacked pixel patent filed more than 4 years ago . The most recent continuation is named " Image Sensor Having Full Well Capacity Beyond Photodiode Capacity " by Xiaofeng Fan. The company proposes a selectable single or dual exposure control in a wafer stacked structure with per-pixel interconnects: " The full well capacity of photodiodes in image sensors generally determines the exposure time, and may also affect the signal to noise ratio and/or the dynamic range of the image sensor. In some embodiments, the full well capacity of the photodiodes in the image sensor may be dynamically adjusted to allow longer exposure times, reducing blooming artifacts in captured images, and to increase the dynamic range of the image sensor. In one embodiment, the image sensor may transfer charge from the photodiode to a storage node one or more times during integration (e.g., the exposure time frame). Transferring the charge during i...

Panasonic is developing a 3D ToF image sensor for AI-based advanced driver monitoring systems. The ToF image sensor has 5.6um pixel optimized for high sensitivity at 940nm wavelength to operate under bright sunlight. This sensor is AEC-Q100 Grade2 compliant and is designed to be used for next-generation in-cabin applications such as gesture-based user interfaces and driver monitoring. The company's ToF web page also shows smartphone and industrial applications for its sensor: Fujitsu UK offers ToF Camera Development Kit :

Pioneer announces that from late September, the company will sequentially start shipping three types and four models of 3D-LiDAR sensors, which adopt the MEMS mirror method and differ in measurement distance: “Telescopic LiDAR”, “Medium-range LiDAR” and “Short-range LiDAR.” Pioneer is developing a high-performance, downsizing, lower price 3D-LiDAR using a MEMS mirror, aiming for mass production in the 2020s. Pioneer provided its first sample for testing September 2017 to companies in Japan and overseas. In response to diverse customer needs, Pioneer is also developing the wobbling scanning method of “Wide-view LiDAR” in addition to the raster scanning method.

RED introduces a camera for shooting immersive 360 degree VR content featuring 16 fish eye cameras with 8K 60fps Super 35mm Helium sensor each (active area 29.9 x 15.77mm2, 3.65um pixels). Thanks to AL for the pointer!